RF芯片商M/A-COM 申请IPO，融资额2.3亿美元
SAN FRANCISCO—Chip and component vendor M/A-COM Technology Solutions Holdings Inc. said Monday （Aug. 1） it filed an S-1 with the U.S. Securities and Exchange Commission for a proposed initial public offering of common stock.
M/A-Com （Lowell， Mass.） said the number of shares to be offered and the price range for the offering have not yet been determined. According to a report by the Dow Jones news service， the total value of the IPO is $230 million.
M/A-Com supplies semiconductors， active and passive components， and sub-assemblies for use in radio frequency （RF）， microwave and millimeter wave applications.
According to the Dow Jones report， M/A-Com reported a steep loss for the nine months ended July 1 on an accretion of Class B conversion liability that totaled $57.1 million. The company‘s revenue for the period grew 24 percent to $231.5 million， according to the Dow Jones report.
A portion of the IPO shares will be issued and sold by M/A-Com and a portion will be sold by certain stockholders of M/A-Com， the company said.
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